Metal plating is a surface treatment process that involves applying a thin metal layer onto the surface of an object. The object being plated is often referred to as the ‘substrate’ and can be a component, part or product. The reason for applying such a coating is to add new, or enhance existing, desirable attributes.
Metal Plating Techniques
There is a wide range of different metal plating techniques, with the most commonly used being electroplating, electroless plating and immersion plating.
Electroplating
Electroplating involves using a process known as electrodeposition. A metal coating is transferred from the anode to the cathode using an electrolyte bath which is subject to a constant electric current.
The metals that can be used in this process include brass, cadmium, chromium, copper, gold, iron, nickel, silver, titanium and zinc. Whilst the most common substrates are made from metals such as stainless steel, the plating can also be applied to plastics, glass and even wood.
Electroless Plating
Whilst electroplating relies on an electric current, electroless plating uses a chemical reaction. The substrate/workpiece is immersed in a special solution which deposits a metal film on the surface.
This technique can be applied to complex shapes with irregular surfaces and provides a uniform coating. It enhances both the durability and the appearance of the substrate.
The most commonly used electroless plating materials are nickel, copper, gold and silver. Electroless plating can also be used to make non-conductive materials conductive, which then allows them to be electroplated.
Electroless Nickel Plating
If you would like to know more about the benefits and applications of electroless nickel plating, there are a number of specialists such as https://www.swmf.co.uk/surface-coatings/electroless-nickel-plating/ who can offer advice and services.
Immersion Plating
The third main type of metal plating, immersion plating, involves immersing the substrate in a solution containing noble metal ions.
This triggers a reaction that deposits a coating onto the substrate’s surface. This process is undertaken at elevated temperatures.
The plating generated with this technique enhances the electrical properties of the substrate and improves adhesion.
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